An A.I.C. capping technology to counter Intel

On 30 July, two persons with direct knowledge of the project revealed that a state-of-the-art chip containment technology similar to that available in Intel was being developed. This suggests that the world ' s leading chip manufacturer is concerned about challenges from distant competitors. The chip wrapping is the final stage of the chip production, at which individual silicon chips are assembled as a whole and linked together to enable them to work as a whole and to connect to other parts of the computer。