NVLink Fusion with next generation high bandwidth memory technology NVHBM

On 28 August, Weida announced the expansion of the NVLink Fusion platform to include the next generation of high-bandwidth memory technology NVHBM, which will provide higher memory and energy efficiency for customizing XPU. Annapurna Labs, the Amazon-based chip team, will take the lead in working with Weeda to integrate the AWS customized chip with the NVHBM and NVLink extensions to enhance the performance and efficiency of the AI workload。