♪ THE WORLD'S ONLY ONE GENERATION AWAY ♪

Long-stretch storage has begun to produce HBM3E in small quantities and is planned to expand production by 2027. HBM is a high-speed memory next to the AI chip and is responsible for the rapid transmission of data to the chip. The restrictions imposed by the United States on exports of HBM2 and above to China since 2024 have been a key shortboard for the national production of AI chips. Domestic chip teams, such as Chiu Chiu and Brother Ali Ping, are already testing the long-stamped HBM, which, if well advanced, will be used for products as soon as next year. The long-sprouts are currently only one generation behind the HBM4 production of SK Hynix, Samsung and U.S.-light, but small-volume production is still far from mature, with a low rate of profitability, speed and reliability. SK Hynix began production of HBM3E as early as 2024, and the three main plants are now in the HBM4 phase and are beginning to sample HBM4E. The next step is to really pull up the good rates and yields。