LONG-STRETCH STORAGE HAS STARTED TO PRODUCE HBM3E IN SMALL QUANTITIES AND PLANS TO EXPAND PRODUCTION BY 2027

The Information cites two sources who claim that long-stamp storage has started to produce HBM3E in small quantities and plans to expand production in 2027. HBM is a high-speed memory next to the AI chip and is responsible for the rapid transmission of data to the chip. The United States, which began to restrict exports of HBM2 and above to China in 2024, has also been a key shortboard for the national AI chip. The domestic chip teams like Chiu-ki and Ali Ping-chul are already testing the long-stamped HBM, which will be used next year at the most. HBM3E is also a generation memory used by Yin Weidar H200 and Blackwell. In terms of product generation, the long-duper is now only one generation behind the HBM4 that SK hynix, Samsung and U.S. Light are producing. However, small quantities are still far from mature. Long-term HBM3E is still low and less fast and reliable than the three plants. SK hynix began production of HBM3E as early as 2024, and the three main plants are now in the HBM4 phase and start sending samples of HBM4E. The next step is to really pull up the good rates and production。