DEUTSCHE GIN, "MEMORY WALL" IS PUSHING THE A.I.C. ON THE OTHER SIDE

According to Deutsche Bank, the continuing “Memory Wall” and memory supply constraints have begun to affect the product routes of the next generation of AI chips. Investors are discussing whether some of the new processors will reduce HBM configurations, while high DRAM prices are beginning to enter the costing of AI ' s total capital expenditure. Supply constraints are driving the emergence of new technologies, including more reliance on SRAM's reasoning chip, customizing HBM case die, HBF and other HBM variants. While the Bank stressed that the relevant engineering programmes were still at a fast-changing stage and the supply chain was less visible, most management believed that the current problems were mainly economic and cost-intensive and that overall DRAM demand was likely to remain high. This has also added a new observation dimension to the HBM boom: the more tight the supply and the higher the price, the more profitable the short-term will be for memory producers, but the easier it will be to stimulate clients to look for more affordable memory structures. The next phase, in addition to looking at HBM capacity and prices, is to see whether the next generation of GPUs, ASIC's single-chip HBM configuration, and other alternatives such as SRAM, HBF, can actually be scaled up. Kim Xian