SemiAnalysis: 9030 chips for Heath Ribbon in the absence of an EUV machine exceeding the state-of-the-art EUV process in Intel

On 21 July, the leading semiconductor and AI research and analysis company sent a letter indicating that it dismantled China as the latest flagship mobile phone core The smallest lead line spacing - metal spacing - of the cylindrium 9030 chip - was measured under an electron microscope, and the smallest metal spacing of the cylindrium 9030 was found to be 32.5 nm. This is smaller than the metal spacing of the Panther Lake chip based on the Intel ' s latest 18A process. CGI was able to reduce the lead line spacing to about 10 per cent less than the state-of-the-art EUV process in Intel without the most advanced equipment and without the EUV optical carving technology。