Young Weida and Amkor signed a $1.5 billion chip seal agreement

On 24 July, a $1.5 billion agreement was signed between Weida and Amkor Technology Inc. to support the latter in upgrading the chip containment facility and expanding the semiconductor industry layout in the United States. In accordance with the statement issued on Thursday, Young Weida will make an advance to Amkor in accordance with the agreement to help upgrade its production capacity in Arizona. Following the announcement, Amkor experienced a major increase of about 15 per cent. The two companies indicated that the cooperation would focus on developing chip containment and testing techniques for artificial intelligence applications. Encapsulation is the key final part of the semiconductor manufacturing process. (FIA)