Lancetech: Sign a cooperation note with Intel CONTENTS
On 24 July, a memorandum of cooperation was signed with Intel Corporation, a wholly-owned subsidiary of Lenth International (Hong Kong) Ltd., in the Lanth Tech Bulletin. The memorandum deals mainly with the parties ' intentions and initial arrangements for cooperation in the area of advanced sealing of glass tremors (TGV), including key processes such as glass base plate piercing, high-precision laser processing, metallic perforation and multilayer interconnected wiring. The two parties will discuss and assess potential cooperation, and Intel will provide information on the structure, design guidelines for manufacturing, baseline testing and validation methods. The memorandum shall remain in force for a period of one year from the date of signature of the authorized representatives of the parties and may be extended by agreement prior to its expiry. Kim Xian
