THE DELAY BY SAMSUNG AND SK HERCULES IN THE APPLICATION OF HYBRID KEYS TO THE CONTAINMENT PROCESS HAS BEEN SIGNIFICANTLY REDUCED OWING TO THE URGENCY OF THE INDUSTRY

ON 9 JULY, ACCORDING TO MARKET NEWS, SAMSUNG ELECTRONICS, SK HERCULES, HAD PLANNED TO USE MIXED-KEY TECHNOLOGY AT HBM4, BUT IS CURRENTLY BEING RECONSIDERED. MIXED KEYS ARE PART OF AN ADVANCED SEMICONDUCTOR CONTAINMENT TECHNOLOGY, WHICH IS EXPECTED TO BE USED AS EARLY AS 16 FLOORS OF HBM4E. THE TWO COMPANIES WERE INFORMED THAT THEY HAD DECIDED TO CONTINUE USING TRADITIONAL THERMAL BONDING TECHNOLOGY, WHICH WAS DELAYED BY THE LIBERALIZATION OF HBM THICKNESS STANDARDS IN THE INDUSTRY, AND BY THE DELAYED ADJUSTMENT OF THE CLIENT ' S HIGH STACK DEMAND。