Three Stars Electronic Announces Memorandum of Understanding with Combustion

ON 25 JULY, SAMSUNG ELECTRONICS STATED THAT A MEMORANDUM OF UNDERSTANDING HAD BEEN SIGNED WITH CHASE TO COVER STORAGE CHIPS, ALTERNATIVE SERVICES AND ADVANCED SEALING OPERATIONS VALUED AT $200 BILLION UP TO 2030; THE NEXT GENERATION OF ARTIFICIAL INTELLIGENCE ACCELERATORS OF SAMSUNG-BASED HBM TECHNOLOGY DEVELOPMENT, INC., WOULD BE IMPLEMENTED IN COOPERATION WITH CHASE. THREE-STAR ELECTRONICS ALSO INDICATED THE PROVISION OF SUB 2 NANOTECHNOLOGIES AND ADVANCED CONTAINMENT SOLUTIONS。