Goldman Sachs continues to upgrade semiconductor equipment and expects to extend until 2028

ON 25 AUGUST, IN THE CONTEXT OF THE PROXIMITY OF THE BRITISH WEEDA NEWSPAPER AND THE INCREASED VOLATILITY OF THE AI CHAIN, GOLDMAN SACHS CONTINUED TO UPGRADE SEMICONDUCTOR EQUIPMENT EXPECTATIONS. ACCORDING TO THE BANK, AI NEEDS ARE PUSHING THE CURRENT ROUND-CYCLE OF EXPENDITURES ON CLIP PLANT EQUIPMENT LONGER AND GLOBAL WFE EXPENDITURES WILL CONTINUE TO EXPAND BETWEEN 2026 AND 2028. GOLDMAN SACHS PREDICTS THAT GLOBAL ROUND-SHOP EQUIPMENT EXPENDITURE WILL REACH $150 BILLION IN 2026, RISING TO $218 BILLION IN 2027 AND FURTHER INCREASING TO $281 BILLION IN 2028, CORRESPONDING TO AN INCREASE OF 36 PER CENT, 45 PER CENT AND 29 PER CENT, RESPECTIVELY. THE DRIVERS ARE MAINLY FROM DRAM, HBM AND ADVANCED PROCESS GENERATION. THE REPORT ALSO NOTES THAT THE SUPPLY OF DRAM MAY CONTINUE INTO 2028, WHICH WILL KEEP THE CAPITAL EXPENDITURE OF THE STORAGE PLANT HIGH。