Thermal technology of microchannels integrated into R & D Blueprint

On 3 September, it was reported that the particle builder had included a new generation of Microchannel distillation technology in the development blueprint. There have been reports that Young Weidar has deliberately introduced micro-channel heat-dispersion technology, but has not been able to land because of the technical difficulties involved. Microchannel heat spread is expected to become a new industry as the power builder takes the lead. It is expected within industry that the microchannel dissipation technology will be introduced in the next generation of Feynman platforms. The build-up will also be aligned with the technological upgrading of large clients and will begin to be invested in research and development in related areas in order to cope with the surge in power consumption caused by a further doubling of the number of transistors and a significant increase in computing power. By that time, single chip effort may even exceed 4,000 watts, and traditional water coolers may be difficult to meet with heat dispersion needs. According to Chen Yan, Director of Advanced Blocking Development and Development of Radio Accumulation, microchannel dispersing technology has helped to improve heat delivery efficiency by setting up microfluorine channels within a chip or encapsulation structure to bring cooling fluids closer to the heat source. Kim Xian